ASML, the Dutch semiconductor equipment leader, is moving to secure its position in the market for hybrid bonding, a sophisticated chip packaging technique. Hybrid bonding allows for denser electrical connections by directly joining silicon wafers or chips, which is essential for boosting the performance of modern semiconductors. According to a recent report by a semiconductor and AI supply chain research firm, ASML filed 27 patent families related to this technology between December 2022 and November 2024.

The shift toward hybrid bonding is part of a broader industry trend. While ASML is positioning itself to provide the necessary equipment for this process, the report highlights that major Chinese semiconductor companies are already actively adopting hybrid bonding to improve their own chip capabilities. By directly connecting components, manufacturers can bypass traditional limitations in chip density and speed. The increase in ASML’s patent activity suggests the company is preparing to compete or provide infrastructure for this specialized manufacturing process as global demand for high-performance chips continues to rise.